Kriti PatelTLDR:
Samsung has established a new research lab in the United States to focus on developing next-generation three-dimensional (3D) DRAM technology. The lab, operating under Device Solutions America (DSA) in Silicon Valley, aims to develop an upgraded DRAM model that will allow Samsung to lead the global 3D memory chip market. Samsung plans to create new 3D structures for sub-10-nanometer DRAM, enabling larger single-chip capacities that exceed 100 gigabits. The move comes as the global semiconductor industry experienced an 8.8% decline in revenue in 2023. Samsung was impacted by the memory market slowdown, reporting a 38% year-on-year decline in revenue.
Samsung has created a new research lab in the US to focus on developing next-generation 3D DRAM technology. The lab will operate under Device Solutions America (DSA) in Silicon Valley and aims to develop an upgraded DRAM model to allow Samsung to lead the global 3D memory chip market. The company plans to create new 3D structures for sub-10-nanometer DRAM, enabling larger single-chip capacities that can exceed 100 gigabits. This move comes as the global semiconductor industry experienced an 8.8% decline in revenue in 2023, with Samsung being impacted by the memory market slowdown, reporting a 38% YoY decline in revenue.
